Scrubber SS-80BW



Features

  1. The SS-80BW features a new technology that enables cleaning of the wafer's bevel area. The cleaning brush is driven and controlled with high precision, to remove contamination on the bevel areas that was considered difficult to clean using chemicals. (This feature is made available by replacing the horizontally rotating brush.)
  2. Cleaning with the horizontally rotating brush shuts out particles from both sides of the wafer. Optional attachments include D-Sonic cleaning, for removing even finer particles using megahertz ultrasonic DI water, and Nanospray/Softspray fluid nozzles.
  3. The SS-80BW's accelerated wafer transfer speed, reduced spin-drying time, and incorporation of four scrubber heads realize exceptional processing speeds and throughput—up to a maximum of 144 wafers per hour (may vary according to system configuration and processing conditions).
  4. The SS-80BW is equipped with an advanced brush pressure control function (option) that ensures stable performance even at extremely low brush pressures. Additionally, the brush rotation speed can be separately controlled for each recipe. These functions optimize wafer cleaning performance according to each specific type of film and its characteristic surface contamination. Moreover, the brush height can be quickly and precisely adjusted simply by entering numerical values from the main panel.
  5. The backside scrubbing unit is equipped with a specially designed spin chuck to prevent wafers from shifting or falling.
  6. Wafer cleaning brushes are available in a wide range of shapes and materials to meet diverse processing demands.
  7. The SS-80BW has been optimally designed and engineered to enhance both operability and maintenance efficiency.
  8. A built-in fan filter unit (FFU) can also be added as an option.

Scrubber SS-W60A

Features

  1. The space between processing units has been reduced by incorporating an original wafer transfer system, and each unit has been compactly designed.
  2. Both sides of the wafer are completely cleaned with our original horizontally rotating brush scrubbing. A D-Sonic cleaning unit (option) using 1.5 MHz ultrasonic DI water can also be incorporated.
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